Pattern formation method and substrate manufacturing apparatus

ABSTRACT

A pattern formation method for discharging a prescribed fluid onto a substrate form an ink-jet head and forming an arbitrary pattern. The method including the steps of discharging the fluid onto the substrate from an ink jet head and defining a pattern-forming region by subjecting the substrate to a specific treatment to prevent the fluid from spreading. The pattern forming region is formed after the fluid has been ejected so that the arbitrary pattern is formed in the fluid corresponding to the pattern-forming region. The treatment is one in which banks for preventing the fluid from flowing out are formed around the pattern-forming region. The method also includes removing the banks following the formation of the pattern.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional patent application of U.S. Ser. No.10/445,621 filed May 27, 2003 now U.S. Pat. No. 6,877,853, which is acontinuation of U.S. patent application Ser. No. 09/232,682 filed onJan. 19, 1999, which is now U.S. Pat. No. 6,599,582 issued Jul. 29,2003, claiming priority to Japanese Patent Application 10-008016, filedJan. 19, 1998, all of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a commercial use of an ink-jet printhead, and more particularly to a manufacturing technique for formingarbitrary patterns with the aid of an ink-jet system.

2. Description of the Related Art

Substrates used in semiconductor processes or the like are formed fromsilicon and the like. Lithographic techniques and the like have beenused in the past for manufacturing integrated circuits and the like fromsuch silicon substrates.

A characteristic feature of the lithographic techniques is that aphotosensitive material called resist is applied thinly to a siliconwafer, and an integrated circuit pattern produced by photolithography ona dry glass plate is transferred by being printed with the aid of light.Ions or the like are implanted into the transferred resist pattern,gradually forming wiring patterns or elements.

Because photolithography, resist application, exposure, development, andother steps are needed in order to be able to use the aforementionedlithographic techniques, fine patterns can only be produced atwell-equipped semiconductor plants or the like. It is natural to expect,therefore, that the formation of fine patterns must involve complicatedprocess control and high costs. accurately fixing pattern materials inpattern-forming regions are needed in order to fix patterns onsubstrates.

It is, however, impossible to realize the benefits, offered bymanufacturing substrates through the use of ink-jet systems in order tofacilitate pattern formation because bulky manufacturing equipment isused in the treatment of such fluids.

In view of this, the inventors of the present application devised atechnique whereby a pattern is subjected to the necessary treatmentsbefore and after ejection from an ink-jet print head, or the moment theink is ejected during the formation of patterns with the aid of an inkjet system.

Specifically, a first object of the present invention is to provide amethod that allows patterns to be formed by enabling treatments to beperformed before a fluid is ejected onto a substrate, and to provide amanufacturing apparatus therefor.

A second object of the present invention is to provide a method thatallows patterns to be formed by enabling treatments to be performedafter a fluid has been ejected onto a substrate, and to provide amanufacturing apparatus therefor.

A third object of the present invention is to provide a method thatallows patterns to be formed by enabling treatments to be performed themoment a fluid is ejected onto a substrate, and to provide amanufacturing apparatus therefore.

The invention addressing the aforementioned first object resides in apattern formation method for discharging a prescribed fluid onto asubstrate from an ink-jet print head and forming an arbitrary pattern,and comprises a step for subjecting the aforementioned substrate to aspecific treatment in advance before the aforementioned fluid isejected, and a accurately fixing pattern materials in pattern-formingregions are needed in order to fix patterns on substrates.

It is, however, impossible to realize the benefits offered bymanufacturing substrates through the use of ink-jet systems in order tofacilitate pattern formation because bulky manufacturing equipment isused in the treatment of such fluids.

In view of this, the inventors of the present application devised atechnique whereby a pattern is subjected to the necessary treatmentsbefore and after ejection from an ink-jet print head, or the moment theink is ejected during the formation of patterns with the aid of an inkjet system.

Specifically, a first object of the present invention is to provide amethod that allows patterns to be formed by enabling treatments to beperformed before a fluid is ejected onto a substrate, and to provide amanufacturing apparatus therefor.

A second object of the present invention is to provide a method thatallows patterns to be formed by enabling treatments to be performedafter a fluid has been ejected onto a substrate, and to provide amanufacturing apparatus therefor.

A third object of the present invention is to provide a method thatallows patterns to be formed by enabling treatments to be performed themoment a fluid is ejected onto a substrate, and to provide amanufacturing apparatus therefor.

The invention addressing the aforementioned first object resides in apattern formation method for discharging a prescribed fluid onto asubstrate from an ink-jet print head and forming an arbitrary pattern,and comprises a step for subjecting the aforementioned substrate to aspecific treatment in advance before the aforementioned fluid isejected, and a step for discharging the aforementioned fluid onto theaforementioned treated substrate from the aforementioned ink-jet printhead.

As used herein, the term “fluid” refers to a medium that can be used notonly for inks but also for other commercial applications, and that has aviscosity level that allows the fluid to be ejected from a nozzle. It issufficient for the fluid to have a fluidity (viscosity) level thatallows it to be ejected from a nozzle or the like, the fluid may bedevoid of additives or may contain admixed solid matter. The ink-jetprint head may belong to a system in which the fluid is ejected by thevolume variations of a piezoelectric element, to a system in which thefluid is ejected as a result of the fact that vapors are rapidly formedby the application of heat, or to a system in which the fluid is ejectedby electrostatic forces. The term “specific treatment” may refer to achemical treatment, physical treatment, or physical-chemical treatment.These definitions are used in a similar manner below.

The invention addressing the aforementioned second object resides in apattern formation method for discharging a prescribed fluid onto asubstrate from an ink-jet print head and forming an arbitrary pattern,and comprises a step for discharging the prescribed fluid onto thesubstrate from the ink-jet print head, and a step for performing aspecific treatment on the substrate onto which the fluid has beenejected.

The invention addressing the aforementioned third object resides in apattern formation method for discharging a prescribed fluid onto asubstrate from an ink-jet print head and forming an arbitrary pattern,and comprises a step for discharging the prescribed fluid from theink-jet print head, and a step for performing a specific treatment onthe droplets of the fluid thus ejected, before the fluid ejected fromthe ink-jet print head reaches the substrate.

The aforementioned treatment may, for example, be one that exertschemical action on the fluid. The term “chemical action” refers toprecipitation, a chemical reaction, or other action affecting asubstance. An example of such a treatment is one in which the solubilityof a prescribed substance contained in the fluid is lowered, and thesubstance is caused to precipitate. This treatment may, for example, beperformed by subjecting the substrate, or the fluid to a hot-air blast,laser irradiation, lamp irradiation, reduced pressure, or ambientvariations (temperature or mist). This treatment may also be one inwhich a substance that induces chemical reactions in the fluid isejected onto the substrate. Furthermore, this treatment may be one inwhich energy is supplied to droplets, and the concentration of the fluidis raised. Moreover, this treatment may be one in which energy issupplied to the droplets, and the trajectory of the droplets is curved.

The aforementioned treatment may, for example, be one that exertsphysical action on the fluid. The term “physical action” refers to amechanical, electrochemical, or magnetochemical effect on the fluid.This treatment may, for example, be one that is designed to align theborders of the ejected fluid with the borders of a pattern-formingregion. This treatment may also be one in which excess fluid is absorbedby an absorbent as a result of the movement of the absorbent along thepattern-forming region.

The aforementioned treatment may, for example, be one that exertsphysical-chemical action on the fluid. The term “physical-chemicalaction” refers to an effect on the fluid behavior from both physical andchemical actions. This treatment may, for example, be one in which thearea of the substrate around the pattern-forming region issurface-modified to eliminate any affinity for the fluid. This treatmentmay also be one in which the pattern-forming region on the substrate issurface-modified to achieve affinity for the fluid. As used herein, theterm “no affinity” refers to the property of having a comparativelylarge contact angle in relation to the fluid. The term “affinity” refersto a comparatively small contact angle in relation to the fluid. Theseexpressions are contrasted with affinity in order to elucidate thebehavior of films in relation to the fluid. This treatment is one inwhich the pattern-forming region on the substrate is surface-modifiedinto an absorption layer for absorbing the fluid. This treatment mayalso be one in which banks for preventing the fluid from flowing out areformed around the pattern-forming region, and which further comprises astep for removing these banks following the formation of the pattern.Furthermore, this treatment may be one in which the same fluid isfurther ejected along a pattern region within which a fluid has alreadybeen, ejected. Furthermore, this treatment may be one in which asubstance that induces chemical reactions in the fluid is made to act ondroplets. In addition, this treatment may also be one in which theattributes of the droplets are detected, and may further comprise a stepfor controlling the ejection of the droplets from the ink-jet print headon the basis of the droplet attributes thus detected.

The present invention, which resides in a substrate manufacturingapparatus for forming an arbitrary pattern on a substrate from aprescribed fluid, comprises an ink-jet print head configured to allowthe fluid to be ejected onto the substrate; treatment means forperforming a specific treatment on the substrate; drive means configuredto allow the relative positions of the ink-jet print head, the treatmentmeans, and the substrate to be varied; and control means for controllingthe ejection of fluid from the ink-jet print head, the treatmentperformed by the treatment means, and the drive effected by the drivemeans. The control means is configured to allow the treatment by thetreatment means to be performed prior to the ejection of fluid from theink-jet print head.

In addition, the present invention, which resides in a substratemanufacturing apparatus for forming an arbitrary pattern on a substratefrom a prescribed fluid, comprises an ink-jet print head configured toallow the fluid to be ejected onto the substrate; treatment means forperforming a specific treatment on the substrate; drive means configuredto allow the relative positions of the ink-jet print head, the treatmentmeans, and the substrate the varied; and control means for controllingthe ejection of fluid from the ink-jet print head, the treatmentperformed by the treatment means, and the drive effected by the drivemeans. The control means is configured to allow the ejection of fluidfrom the ink-jet print head to be performed prior to the treatmentcarried out by the treatment means.

The present invention, which resides in a substrate manufacturingapparatus for forming an arbitrary pattern on a substrate from aprescribed fluid, comprises an ink-jet print head configured to allowthe fluid to be ejected onto the substrate; treatment means forperforming a specific treatment on the droplets of the fluid ejectedfrom the ink-jet print head before these droplets reach the substrate;drive means configured to allow the relative positions of the ink-jetprint head, the treatment means, and the substrate to be varied; andcontrol means for controlling the ejection of fluid from the ink-jetprint head, the treatment performed by the treatment means, and thedrive effected by the drive means.

The aforementioned treatment means may, for example, be configured toallow chemical action to be exerted on the fluid.

In addition, the treatment means is configured to allow the solubilityof a prescribed substance contained in the fluid to be lowered, and thesubstance to be precipitated.

Furthermore, the treatment means is configured to allow a substance thatinduces chemical reactions in the fluid to be ejected onto thesubstrate.

Moreover, the treatment means is configured to allow physical action tobe exerted on the fluid.

In addition, the treatment means is configured to allow the borders ofthe ejected fluid to be aligned with the borders of a pattern-formingregion.

Furthermore, the treatment means comprises an absorbent, and the controlmeans allows excess fluid to be absorbed by the absorbent as a result ofthe relative movement of the absorbent along the pattern-forming region.

Moreover, the treatment means is configured to allow physical-chemicalaction to be exerted on the fluid.

In addition, the treatment means is configured to allow the area of thesubstrate around the pattern-forming region to be surface-modified toeliminate any affinity for the fluid. The term “no affinity” refers tothe property of having a comparatively large contact angle in relationto the fluid. These expressions are contrasted with affinity in order toelucidate the behavior of films in relation to the fluid.

Furthermore, the treatment means is configured to allow thepattern-forming region on the substrate to be surface-modified toachieve affinity for the fluid. As used herein, the term “affinity”refers to a comparatively small contact angle in relation to the fluid.

Moreover, the treatment means is configured to allow the pattern-formingregion on the substrate to be surface-modified into an absorption layerfor absorbing the fluid.

In addition, the treatment means is configured to allow banks forpreventing the fluid from flowing out to be formed around thepattern-forming region, and this manufacturing apparatus furthercomprises means for removing these banks following the formation of thepattern.

The present invention, which resides in a substrate manufacturingapparatus for forming an arbitrary pattern on a substrate from aprescribed fluid, comprises an ink-jet print head configured to allowthe fluid to be ejected onto the substrate, drive means configured toallow the relative positions of the substrate and the ink-jet print headto be varied, and control means for controlling the ejection of fluidfrom the ink-jet print head and the drive effected by the drive means.In the control means, the same fluid is further ejected from the ink-jetprint head along a pattern region within which a fluid has already beenejected.

The treatment means may, for example, be configured to allow energy tobe supplied to droplets, and the concentration of this fluid to beraised.

In addition, the treatment means is configured to allow energy to besupplied to droplets, and the trajectory of the droplets to be curved.

Furthermore, the treatment means is configured to allow a substance thatinduces chemical reactions in the fluid to be fed to the droplets.

Moreover, the treatment means is configured to allow the attributes ofthe droplets to be detected, and the control means controls the ejectionof the droplets from the ink-jet print head and the drive performed bythe drive mean on the basis of the droplet attributes detected by thetreatment means.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of the substrate manufacturing apparatus in anembodiment of the present invention.

FIG. 2 is a diagram illustrating a first arrangement (pretreatment).

FIG. 3 is a diagram illustrating a second arrangement (aftertreatment).

FIG. 4 is a diagram illustrating a third arrangement (a treatment thatimmediately follows ejection).

FIG. 5 is a side view depicting the treatment concept of Embodiment 1.

FIG. 6 is a side view depicting the treatment concept of Embodiment 2.

FIG. 7 is a plan view depicting the treatment concept of Embodiment 3.

FIG. 8 is a plan view depicting the treatment concept of Embodiment 4.

FIG. 9 is a side view depicting the treatment concept of Embodiment 5.

FIG. 10 is a plan view depicting the treatment concept of Embodiment 6.

FIG. 11 is a diagram depicting the treatment concept of Embodiment 7,where (a) is a plan view, and (b) is a side view.

FIG. 12 is a diagram depicting the treatment concept of Embodiment 8,where (a) is a plan view, and (b) is a side view.

FIG. 13 is a side view depicting the treatment concept of Embodiment 9.

FIG. 14 is a side view-depicting the treatment concept of Embodiment 10.

FIG. 15 is a plan view depicting the treatment concept of Embodiment 11.

FIG. 16 is a plan view depicting the treatment concept of Embodiment 12.

FIG. 17 is a diagram of the treatment concept of Embodiment 13.

FIG. 18 is an exploded perspective view of an ink-jet print head.

FIG. 19 is a perspective view/partial cross-sectional view of the mainportion of the ink-jet print head.

FIG. 20 is a diagram illustrating the ejection principle of the ink-jetprint head.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The best mode for carrying out the present invention will now bedescribed with reference to drawings.

(Common Structure)

FIG. 1 is a schematic block diagram of the common components of thesubstrate manufacturing apparatus used in the embodiments that follow.As shown in FIG. 1, the substrate manufacturing apparatus 100 itselfcomprises an ink-jet print head 2, a treatment apparatus 3, a drivemechanism 4, and a control circuit 5. In the embodiments that follow,the configuration of the treatment apparatus 3 and the treatmentspecifics are different in each case, but the rest of the structure issubstantially the same in all the embodiments.

An ink tank 26 filled with a fluid 10 is connected to the ink-jet printhead 2 with a pipe 27 to allow the fluid 10 to be fed in. Anyhydrophilic or hydrohobic fluid can be used as the fluid 10 as long asit has the fluidity that allows it to be ejected from the ink-jet printhead. The entire composition may be other than fluid. It is possible,for example, to use a composition obtained by adding anelectroconductive metal in the form of fine particles to a solvent.

The structure of the ink-jet print head will first be described. FIG. 18is an exploded perspective view of the ink-jet print head 2. It issufficient for the ink-jet print head 2 to be configured as a commonink-jet print head capable of discharging any fluid. The ink-jet printhead 2 in FIG. 18 is obtained by fitting into a casing 25 a nozzle plate21 equipped with nozzles 211, and a pressure chamber substrate 22equipped with a diaphragm 23. The pressure chamber substrate 22 may, forexample, be formed by silicon etching and provided with cavities(pressure chambers) 221, side walls 222, a reservoir 223, and the like.

FIG. 19 is a perspective view/partial cross-sectional view of thestructure of the main portion of the ink-jet print head 2 obtained bystacking the nozzle plate 21, pressure chamber substrate 22, anddiaphragm 23. As shown in the drawing, the main portion of the ink-jetprint head 2 is configured such that the pressure chamber substrate 22is sandwiched between the nozzle plate 21 and the diaphragm 23. Thenozzles 211 in the nozzle plate 21 are formed such that their positionscorrespond to the cavities 221 when the plate is placed on top of thepressure chamber substrate 22. By etching a silicone monocrystalsubstrate or the like, the pressure chamber substrate 22 is providedwith a plurality of cavities 221 capable of functioning as individualpressure chambers. The cavities 221 are separated by side walls 222.Each cavity 221 is connected by a supply port 224 to a reservoir 223,which is a common conduit. The diaphragm 23 may, for example, becomposed of a thermally oxidized film or the like. Piezoelectricelements 24 are formed at positions corresponding to the cavities 221 onthe diaphragm 23. The diaphragm 23 is also provided with an ink tankport 231 to allow any fluid 10 to be fed from the tank 26. Thepiezoelectric elements 24 may, for example, be configured such that PZTelements or the like are sandwiched between an upper electrode and alower electrode (not, shown). The piezoelectric elements 24 areconfigured such that volume variations can occur in accordance with thecontrol signals Sh fed from the control circuit 5.

Although the above-described ink-jet print head was configured such thatpiezoelectric elements were caused to change their volume, and a fluidwas ejected, it is also possible to use a head structure in which heatis applied to the fluid by a heater, and droplets are ejected by theresulting expansion.

The treatment apparatus 3 is configured to allow a prescribed treatmentto be performed on a substrate 1. The treatment apparatus 3 performs thetreatment in accordance with control signals Sp from the control circuit5. The functions and structure of the treatment apparatus 3 will becomeapparent from the embodiments that follow.

The drive mechanism 4, which comprises a motor M1, a motor M2, and amechanism structure (not shown), is configured to allow both the ink-jetprint head 2 and the treatment apparatus 3 to be conveyed in thedirection of the X-axis (transverse direction in FIG. 1) and in thedirection of the Y-axis (depth direction in FIG. 1). Motor M1 isconfigured to allow the ink-jet print head 2 and the treatment apparatus3 to be conveyed in the direction of the X-axis in accordance with drivesignals Sx. Motor M2 is configured to allow the ink-jet print head 2 andthe treatment apparatus 3 to be conveyed in the direction of the Y-axisin accordance with drive signals Sy.

It is sufficient for the drive mechanism 4 to be provided with astructure that allows the positions of the ink-jet print head 2 andtreatment apparatus 3 to be varied relative to the substrate 1. It istherefore possible, in addition to the above-described structure, to usean arrangement in which the substrate 1 is moved in relation to theink-jet print head 2 or the treatment apparatus 3, or an arrangement inwhich both the substrate 1 and the ink-jet print head 2 (and thetreatment apparatus 3) are moved. Furthermore, certain types oftreatment do not require that the treatment apparatus 3 be conveyedtogether with the ink-jet print head 2, and allow the treatmentapparatus 3 to be conveyed or to remain stationary.

The ejection principle of the ink-jet print head 2 is described withreference to FIG. 20. This drawing is a cross section along line A—A inFIG. 20. The fluid 10 is fed from the tank 26 into the reservoir 223through the ink tank port 231 provided to the diaphragm 23. The fluid 10flows from this reservoir 223 into each cavity 221 through the supplyport 224. The volume of the piezoelectric element 24 varies when voltageis applied between the upper and lower electrodes thereof. This volumechange deforms the diaphragm 23 and varies the volume of the cavity 221.

The diaphragm 23 remains undeformed in as long as no control signal Shis provided or voltage applied. When a control signal Sh is, providedand voltage applied, the diaphragm 23 b or the post-deformationpiezoelectric element 24 b is deformed, reaching the position shown bythe broken line in the figure. When the internal volume of the cavity 21changes, the pressure of the fluid 10 in the cavity 21 rises. The fluid10 is fed to the nozzle 211, and a droplet 11 is ejected.

(Arrangement Aspects)

Basic treatment arrangements of the present invention will be describedwith reference to FIGS. 2–4. The present invention will be described byconsidering three separate arrangements for the treatment apparatus usedon the fluid ejected from the ink-jet print head.

FIG. 2 is a concept diagram of a first arrangement for treating thesubstrate before the fluid is ejected from the ink-jet print head. Asshown in the drawing, the ink-jet print head 2 and the treatmentapparatus 3 are conveyed in a relative fashion in the conveyancedirection designated by an arrow. In the first arrangement, thetreatment apparatus 3 is disposed in front of the ink-jet print head 2in the direction of advance. A prescribed treatment 7 is performed onthe substrate 1 before droplets 11 of the fluid are ejected from theink-jet print head 2 onto the substrate 1. Treatment specifics will bedescribed with reference to an embodiment that follows.

FIG. 3 is a concept diagram of a second arrangement for treating thefluid or the substrate after the fluid has been ejected from the ink-jetprint head. As shown it the drawing, the ink-jet print head 2 and thetreatment apparatus 3 are conveyed in a relative fashion in theconveyance direction designated by an arrow. In the second arrangement,the treatment apparatus 3 is disposed behind the ink-jet print head 2 inthe direction of advance. A prescribed treatment 7 is performed on thesubstrate 1 after droplets 11 of the fluid have been ejected from theink-jet print head 2 onto the substrate 1. Treatment specifics will bedescribed with reference to an, embodiment that follows.

FIG. 4 is a concept diagram of a third arrangement for directly treatingdroplets of the fluid ejected from the ink-jet print head. In the thirdarrangement, the treatment apparatus 3 is disposed to allow directtreatment of the droplets 11 ejected from the ink-jet print head 2. Aprescribed treatment 7 is performed on the droplets 11 of the fluidejected from the ink-jet print head 2 before these droplets reach thesubstrate 1. Treatment specifics will be described with reference to anembodiment that follows.

(Embodiment 1)

Embodiment 1 of the present invention relates to a treatment that exertsaction (reduction in solubility) on the fluid, and is primarily used inthe first and second arrangements described above.

FIG. 5 is a side view illustrating the treatment concept ofEmbodiment 1. The treatment apparatus 301 of Embodiment 1 is configuredsuch that a treatment 701 for lowering the solubility of substancesadmixed into the fluid and precipitating these substances as solids canbe applied to the substrate 1 before a droplet 1 is rejected. Atreatment in which a hot-air blast, laser irradiation, lamp irradiation,or the like is performed to vaporize the solvent components of the fluidcan be suggested as such a treatment. Although the drawing depicts thestructure utilized for the first arrangement, the treatment apparatus301 can be disposed behind the ink-jet print head 2 in the direction ofadvance when the structure is utilized for the second arrangement.

When hot air is to be blown, the treatment apparatus 301 is equippedwith a compressor for blowing air, a heat for heating the air, and thelike. When laser irradiation is to be performed, the system is equippedwith a laser light-emitting diode for generating laser light with aprescribed wavelength, a lens array for gathering the laser light, anactuator apparatus for driving the lens array and appropriatelygathering the laser light on the substrate, and the like. When lampirradiation is performed, the system is equipped with a xenon lamp (orother lamp capable of emitting high energies), a reflector, a lensarray, and the like.

When the above-described treatment apparatus 301 is used in the firstarrangement for performing pretreatments, the aforementioned treatmentis performed on the substrate 1 immediately before a droplet 11 of thefluid is ejected. Because the substrate 1 is already heated, the solventcomponents of a droplet reaching the substrate are vaporized immediatelyafter the contact, and the fluid is concentrated, with the result thatthe solids remain or the dissolved product precipitates. When, forexample, the fluid is obtained by adding fine metal particles to asolvent, the solvent components alone are vaporized by the action ofheat, and the fine metal particles remain on the substrate as aconductive pattern.

When the above-described treatment apparatus 301 is used in the secondarrangement for performing aftertreatments, the a aforementionedtreatment is performed on the droplets of fluid that have already beenejected onto the substrate. The dissolved product can be precipitated bythe same action.

In addition to the above-described treatment, it is also possible to usea configuration that allows the atmosphere to be varied or the pressureto be lowered locally. Such a configuration makes it possible to lowerthe solubility of the dissolved product in the fluid and, as a result,to allow the dissolved product to precipitate. An arrangement in whichthe entire substrate is heated or the like can also be added to themodification examples of the present embodiment. A heating device or thelike is therefore provided to the mounting platform of the substrate 1.

Thus, Embodiment 1 allows solids to be retained in, or precipitatedfrom, the fluid by the application of energy, and patterns can be easilyformed. In addition, the treatment apparatus merely performs heatinglocally, making it possible to reduce the size of the heating equipmentand to curtail energy consumption.

(Embodiment 2)

Embodiment 2 of the present invention relates to a treatment thatinduces chemical action (chemical reaction) in the fluid, and isprimarily used in the first and second arrangements described above.

FIG. 6 is a side view illustrating the treatment concept of Embodiment2. The treatment apparatus 302 of Embodiment 2 is configured such that areaction solution 702 capable of breaking up a disperse system orinitiating a chemical reaction in the fluid is ejected on the substrate1 before the fluid 10 is ejected. The same structure as that of theink-jet print head 2 should preferably be used as the treatmentapparatus 302. This is because substantially the same amount of reactionsolution as that of the fluid droplets 11 can be ejected in a controlledmanner. Although the drawing depicts the structure utilized for thefirst arrangement, the treatment apparatus 302 is disposed behind theink-jet print head 2 in the direction of advance when the structure isutilized for the second arrangement.

When an organic pigment dispersed with a styrene-acrylic resin is theprincipal component of the fluid droplets 11, discharging an aqueoussolution of magnesium nitrate as the reaction solution 702 can be citedas an example of a treatment that breaks up a disperse system. Inaddition, when an epoxy resin is the principal component of the fluiddroplets 11, discharging amines as the reaction solution 702 can becited as an example of a treatment that initiates chemical reactions.

When the above-described treatment apparatus 302 is used in, the firstarrangement for performing pretreatments, the aforementioned reactionsolution 702 is ejected within a pattern-forming region before thedroplets 11 of fluid are ejected. The disperse system is broken up orchemical reactions are initiated and solid matter 13 is deposited whenthe droplets 11 impinge on the pattern-forming region within which thereaction solution 702 has been ejected. When, for example, the droplets11 contain a metal salt, a conductive metal pattern can be formed bymaking use of a reaction solution 702 that is reactive with this salt.

When the above-described treatment apparatus 3 is used in the secondarrangement for performing aftertreatments, the reaction solution 702 isejected in relation to the droplets 11 of fluid that have already beenejected onto the substrate. The solid matter 13 can be formed by thesame action.

Although two ink-jet print heads were used in the embodiments describedabove, the number of heads capable of discharging other reactionsolutions should be increased in order to initiate more complicatedreactions.

According to Embodiment 2, patterns can be formed merely by providing aplurality of ink-jet print heads because the disperse system can bebroken up or chemical reactions initiated with a reaction solution, asdescribed above. In particular, a plurality of heads having the sameconfiguration should be provided, and solely the substance ejectedtherefrom should be varied, making it easier to design manufacturingapparatus.

(Embodiment 3)

Embodiment 3 of the present invention relates to a treatment forimproving the affinity of the substrate as a physical-chemical action,and is primarily used in the first arrangement described above.

FIG. 7 is a plan view illustrating the treatment concept of Embodiment3. The treatment apparatus 303 of Embodiment 4 is configured such thatthe pattern-forming region of the substrate 1 can be surface-modified toachieve affinity for the fluid 10 before this fluid has been ejectedonto the substrate.

The following methods can be used as surface modification treatmentsaimed at achieving affinity when the fluid contains polar molecules(moisture and the like): methods for applying silane coupling agents;methods for forming aluminum oxide, silica, and other porous films; andmethods for performing reverse sputtering in argon or the like; as wellas corona ejection treatments, plasma treatments, ultravioletirradiation treatments, ozone treatments, degreasing treatments, andvarious other known methods. Methods for applying paraffin or the like,gas plasma treatments, coupling treatments, and the like may be usedwhen the fluid is devoid of polar molecules.

When a silane coupling agent is used, the treatment apparatus 303 isconfigured such that it is possible to apply organosilicon compounds(silane coupling agents) having alkoxy groups, halogens, and otherhydrolyzable substituent groups readily reactive toward inorganicsubstances, as well as vinyl groups, epoxy groups, and amino groupsreadily reactive toward organic substances. Ejection of materials fromink-jet print heads, and direct application with application mechanismsresembling ball-point pens can be suggested as an application method.When porous films are to be formed, the treatment apparatus 303 isconfigured to allow application of porous materials such as Al₂O₃ andsilica. The application methods are the same as described above. Asputtering apparatus is used as the treatment apparatus 303 for a methodinvolving reverse sputtering. Specifically, a cathode, an electrode inwhich the substrate serves as the anode, a mechanism for adjusting theargon atmosphere, a power source, and the like are provided. Through areverse sputtering treatment, the substrate surface is activated,replacement with hydrophilic substituent groups is achieved, and thesubstrate surface is modified. When a corona discharge is used, ahigh-voltage discharge electrode is provided as the treatment apparatus303, and a structure is set up such that ground voltage can be appliedto the substrate 1. Some of the organic molecules of the substrate arereplaced with hydrophilic groups, and the substrate surface is modifiedby the local application of high voltage to the surface. To perform aplasma treatment, the treatment apparatus 303 is configured such that itis possible to eject a plasma generated by a gas discharge. Anultraviolet irradiation lamp is provided as the treatment apparatus 303when ultraviolet light is to be used for irradiation. When an ozonetreatment is to be performed, the treatment apparatus 303 is configuredsuch that a prescribed voltage can be applied in an atmosphere ofcirculating ozone, and the activated ozone can be released onto thesubstrate. When a degreasing treatment is to be performed, the treatmentapparatus 303 is configured to allow permanganic acid, chromic acid,sulfuric acid, nitric acid, or another strong alkali to be fed to thesubstrate. When paraffin or the like is to be applied, an applicationmechanism resembling an ball-point pen is used for the treatmentapparatus 303, and dissolved paraffin or the like is applied to a regioncentered on the two sides of the pattern-forming region.

If a silane coupling agent has been applied, the presence of theabove-described treatment apparatus 303 causes the silane couplingagent, which has been applied to a pattern-forming region 703, to bondwith the substrate material whereas groups readily wettable by water areexposed on the surface. If a porous film has been formed, the aluminumoxide, silica, or other film formed in the pattern-forming region 703 isapt to contain fluid because of its porosity. If reverse sputtering hasbeen performed, the surface temperature of the pattern-forming regionrises, making it possible to improve film adhesion and to achievetransformation to a hydrophilic film. If a corona discharge has beengenerated, hydrophilic properties are achieved because of the formationof OH groups or COOH groups on the substrate surface. If a plasmatreatment has been performed, the products are a cross-linked layer andunreacted groups of the macromolecules on the substrate surface. Theunreacted groups are readily oxidized, yielding OH groups, C═O groups,CHO groups, COOH groups, and the like, and providing hydrophilicproperties. If ultraviolet light is used to irradiate a substrate or thelike obtained using polyester or polypropylene, OH groups or COOH groupsare produced and hydrophilic properties afforded. If ABS, polypropylene,or the like has been treated with ozone, surface affinity is improved.If a degreasing treatment has been performed, the substrate surface isoxidized, replacement with hydrophilic groups is achieved, andhydrophilic properties are afforded. If an application treatmentinvolving paraffin or the like has been performed, the coated region hasaffinity for nonpolar molecules, and is thus readily wettable if thefluid consists of nonpolar molecules.

In accordance with the above-described Embodiment 3, a film havingaffinity for the surface-modified pattern-forming region 703 is formedprior to the ejection of fluid from the ink-jet print head 2, creatingonly a slight danger of separation or excessive spreading for thedroplets 12 (*8) impinging on the pattern-forming region.

(Embodiment 4)

Embodiment 4 of the present invention relates to a treatment for forminga region with no affinity on both sides of a pattern as aphysical-chemical action, and is primarily used in the first arrangementdescribed above.

FIG. 8 is a plan view illustrating the treatment concept of Embodiment4. The treatment apparatus 304 of Embodiment 4 is configured to allow afilm 704 with no affinity for the fluid to be formed in a region outsidethe pattern-forming region of the substrate 1.

The above-described methods for applying paraffin or the like can becited as examples of treatments for forming a zero-affinity film whenthe fluid contains polar molecules. The following methods, which aredescribed in Embodiment 3 above, can be used when the fluid is devoid ofpolar molecules: methods for applying silane coupling agents; methodsfor forming aluminum oxide, silica, and other porous films; and methodsfor performing reverse sputtering in argon or the like; as well ascorona discharge treatments, plasma treatments, ultraviolet irradiationtreatments, ozone treatments, degreasing treatments, and various otherknown methods.

Methods for forming films with no affinity for nonpolar molecules orfilms having affinity for polar molecules are the same as those inEmbodiment 3 above, and their description will therefore be omitted.

According to Embodiment 4, a film 704 with no affinity for the fluid isformed on both sides of a pattern-forming region before the fluid isejected from the ink-jet print head 2 as described above, so the fluidthat has overflowed the pattern-forming region is repelled by thezero-affinity film 704, and can thus be confined to the pattern-formingregion.

(Embodiment 5)

Embodiment 5 of the present invention relates to a treatment for forminga pattern-forming region to ensure fluid absorption as aphysical-chemical action, and is primarily used in the first arrangementdescribed above.

FIG. 9 is a side view illustrating the treatment concept of Embodiment5. The treatment apparatus 305 of Embodiment 5 is configured such thatan absorption layer 705 for absorbing fluids is formed in thepattern-forming region of the substrate 1.

Polyvinyl alcohol (PVA), polyvinyl acetate, or the like can be used forthe absorption layer 705. It is believed that the treatment apparatus305 should be equipped with an application mechanism resembling aball-point pen in order to apply the polyvinyl alcohol.

In the aforementioned arrangement, the treatment apparatus 305 forms theabsorption layer 705 prior to fluid ejection, and droplets 11 of a fluidare ejected from the ink-jet print head 2 onto the absorption layer 705thus formed. The droplets 11 of the fluid thus ejected are partiallyabsorbed by the absorption layer 705, and the fluid is fixed inside alayer 14. A pattern is thus formed in the region where the absorptionlayer has been formed.

According to Embodiment 5, the treatment apparatus 305 forms anabsorption layer prior to the ejection of fluid from the ink-jet printhead 2, allowing a pattern to be formed in accordance with theabsorption layer, and excess fluid to be absorbed by the absorptionlayer.

(Embodiment 6)

Embodiment 6 of the present invention relates to a treatment for formingbanks (in the form of dikes) that inhibit the outflow of fluid near theborders of the pattern-forming region as a physical-chemical action, andis primarily used in the first arrangement described above.

FIG. 10 is a plan view illustrating, the treatment concept of Embodiment6. The treatment apparatus 306 of Embodiment 6 is configured to allow aplurality of banks 706 for inhibiting fluid outflow to be formed nearthe borders of the pattern-forming region on the substrate 1. Aplurality of application mechanisms resembling ball-point pens are usedas the treatment apparatus 306 because the bank material must be formedto a specific height. Each application mechanism is disposed in thewidth direction of the pattern-forming region at a distance equal to thewidth thereof. Polyimides, acrylic resins, epoxy resins, and the likecan be suggested as the materials for the banks 706.

The treatment apparatus 306 thus configured gradually forms banks 706prior to fluid ejection. When fluid droplets 11 are ejected in thepattern-forming region following bank formation, the presence of thebanks 706 prevents the fluid from escaping beyond the banks. The fluidsolidifies in the pattern-forming region enclosed within the two banks.

It is preferable that a step for removing the banks 706 following fluidsolidification be provided. This is because the banks are no longerneeded once the fluid has been fixed as a pattern. Plasma ashing,etching, or another method may be used for such bank removal.

According to Embodiment 6, the fluid can be prevented from escapingbeyond the pattern-forming region because the banks are formed prior tothe ejection of fluid from the ink-jet print head. Bank width can bekept small by removing the banks following pattern fixing.

(Embodiment 7)

Embodiment 7 of the present invention relates to a treatment forarranging the ejected fluid as a physical action, and is primarily usedin the second arrangement described above.

FIG. 11 is a diagram depicting the treatment concept of Embodiment 7,where FIG. 11A is a plan view, and FIG. 11B is a side view. Thetreatment apparatus 310 of Embodiment 7 is provided with a plurality ofneedle members 710 in order to ensure that the fluid 12 impinging on thesubstrate 1 is distributed along the borders of the pattern-formingregion by rubbing. Each needle member 710 is disposed in the widthdirection of the pattern-forming region at a distance equal to the widththereof. The needle members 710 should preferably have specificmechanical strength, yet be sufficiently elastic to prevent substratedamage. The needle members 710 therefore consist of a resin, rubber,soft metal, or other such material.

When the ink-jet print head 2 ejects a fluid onto a substrate in thearrangement described above, the pattern-forming region is struck in aejection direction that contains errors, albeit small. Consequently, theimpact positions have borders that fall outside the pattern-formingregion in some areas even when the positions themselves aresubstantially aligned with the longitudinal direction of thepattern-forming region. The treatment apparatus 310 distributes theoverflowing fluid 12 along the borders of the pattern-forming region byrubbing, returning the overflowed portions back to the confines of thepattern-forming region and forming a pattern 15 of specific width.

According to Embodiment 7, a regularly shaped pattern can be formedbecause the treatment apparatus 310 arranges the pattern in an orderlyfashion even if the droplets of fluid previously ejected by the ink-jetprint head 2 have misaligned impact positions.

(Embodiment 8)

Embodiment 8 of the present invention relates to a treatment forabsorbing excess impact fluid as a physical action, and is primarilyused in the second arrangement described above.

FIG. 12 is a diagram illustrating the treatment concept of Embodiment 8,where FIG. 12A is a plan view; and FIG. 12B is a side view. Thetreatment apparatus 311 of Embodiment 8 comprises an absorbing member711 that moves along the pattern-forming region and is configured toallow excess fluid 12 impinging on the substrate 1 to be absorbed. Theabsorbing member 711 should preferably be shaped as a pipe capable ofabsorbing excess fluid. It is also possible to adopt an arrangement inwhich the absorbed fluid can be ejected again from the ink-jet printhead 2. The absorbing member 711 should preferably have specificmechanical strength, yet be sufficiently elastic to prevent substratedamage. The absorbing member therefore consists of a resin, rubber, softmetal, or other such material.

The pattern is more difficult to disrupt when an excess of fluid isejected from the ink-jet print head 2. Droplets of excess fluid falloutside the necessary pattern-forming region, however. In the presentembodiment, the absorbing member 711 of the treatment apparatus 311gradually absorbs excess fluid immediately after droplets of the fluidimpinge on the substrate. Consequently, the fluid is prevented fromspreading beyond the pattern-forming region. In addition, the fluidmaterial can be conserved by returning the absorbed fluid to the ink-jetprint head 2.

(Embodiment 9)

Embodiment 9 of the present invention relates to a treatment fordischarging a fluid with a time difference as a physical action, and isprimarily used in the first and second arrangements described above.

FIG. 13 is a side view illustrating the treatment concept of Embodiment9. In Embodiment 9, ink-jet print heads 2 configured to allow fluids tobe ejected are provided as treatment apparatus. Specifically, thisarrangement involves disposing at a specific distance ink-jet printheads 2 for discharging the same fluid, and allows the fluid to beejected within the same pattern-forming region in a relative back andforth manner.

In the above arrangement, a front ink-jet print head 2 a ejects droplets11 a such that the impact marks 12 a of the fluid are disposed atcertain intervals on the pattern-forming region. A back ink-jet printhead 2 b ejects fluid droplets 11 b in a controlled manner to arrive atan amount sufficient for the pattern-forming region to be filled withthe fluid in combination with the already deposited fluid 12 a. Surfacetension acts on the previously deposited fluid 12 a, as it does on thesubsequently deposited fluid 12 b. When other droplets fall on thedroplets experiencing surface tension, the surface tension prevents thetwo types of droplets from intermixing, and the subsequently fallingdroplets slide on the previously deposited droplets and fall along theirperipheries. Consequently, the present embodiment allows droplets 11 b(*10) of the subsequently ejected fluid to be deposited on the areasdevoid of the previously deposited fluid 12 a because the latter isdeposited at prescribed intervals. The fluid is therefore depositedwithin the pattern-forming region at a constant density and without anygaps.

The above-described aspect may also be such that a single ink-jet printhead 2 is provided, and a control circuit 5 is provided to allowreciprocating motion to be performed over the same pattern-formingregion. This is because this arrangement provides the same effect interms of discharging a fluid with a time difference. In this case, thebenefit is that the number of heads can be reduced.

Because Embodiment 9 involves discharging a fluid with a timedifference, the density of the liquid impinging on the substrate can bemade uniform, and patterns of uniform thickness can be formed.

(Embodiment 10)

Embodiment 10 of the present invention relates to a treatment forraising the concentration of droplets by laser irradiation as a chemicalaction, and is primarily used in the third arrangement described above.

FIG. 14 is a side view illustrating the treatment concept of Embodiment10. In Embodiment 10, the treatment apparatus 320 is configured inaccordance with the third arrangement such that laser light 720 can bedirected from the sides toward the droplets 11 of a fluid ejected by anink-jet print head 2. Specifically, the treatment apparatus 320comprises a laser light-emitting diode (not shown), a lens, and anactuator for irradiation with laser light. The laser light-emittingdiode emits laser light of prescribed short wavelength as an energysource, and the lens is configured such that this laser light can begathered on the droplets. The actuator is configured to allow thepositions of the lens and the laser light-emitting diode to be correctedin order to properly focus laser light 720 on the droplets 11.

Although it is preferable for laser light to be used for irradiation asa means of supplying energy instantaneously, this is not the only optionas far as supplying energy to the droplets is concerned. It is alsopossible to feed a hot blast, to perform irradiation with a lamp, tocreate an atmosphere, or to carry out any of a variety of otheroperations.

When fluid droplets 11 are ejected from the ink-jet print head 2 in theabove-described configuration, laser light 720 emitted by the treatmentapparatus 320 at a prescribed location is focused on the droplets 11.High energy can thereby be instantaneously imparted to the droplets 11.The temperature of the energized droplets 11 increases, raising theconcentration of matter dissolved in the fluid or promoting filmformation by the contained solids. The content of dissolved componentswhose presence is not needed before the impact is thus reduced, and thefluid impinges on the substrate 1 in the minimum composition requiredfor pattern formation. Consequently, fluid concentration can beincreased to a level suitable for pattern formation even when the fluidviscosity required for ejection from an ink-jet print head is lower thanthe fluid viscosity suitable for pattern formation.

According to Embodiment 10, excessive spreading of the fluid impingingon a substrate can be prevented and the elapsed time until patternformation can be reduced because it is now possible to remove dissolvedcomponents whose presence is not needed before the impact of thedroplets 11 ejected from the ink-jet print head 2.

(Embodiment 11)

Embodiment 11 of the present invention relates to a treatment forbending the trajectory followed by the droplets of a fluid by causingthem to collide with other droplets as a physical action, and isprimarily used in the third arrangement described above.

FIG. 15 is a plain view illustrating the treatment concept of Embodiment11. In Embodiment 11, the treatment apparatus 321 are disposed inaccordance with the third arrangement in the direction perpendicular tothe longitudinal direction of the pattern-forming region, facing eachother across an ink-jet print head 2. Each of the treatment apparatus321 is equipped with a structure capable of imparting energy to thedroplets from a different direction. A structure capable of dischargingprescribed droplets (for example, a structure similar to the ink-jetprint head 2) is provided when the imparted energy is the mechanicalenergy resulting from collisions among prescribed droplets. The term“prescribed droplets” refers to reaction solutions for initiating thereactions described below when such chemical reactions are intended, andto the ejection of the same fluid as that ejected from the ink-jet printhead 2 when the goal is not to initiate such reactions. A compressor, anozzle, and other components for blowing air are provided when air is tobe used as such energy. When an electric field is to be used as theenergy, electrodes are installed on both sides of the trajectoryfollowed by the droplets 11 of the fluid, and a power source is providedfor applying voltage between the electrodes. When an electric field isused, a structure is also provided for charging positively or negativelythe droplets 11 of the fluid ejected by the ink-jet print head 2.

When fluid droplets 11 are ejected from the ink-jet print head 2 in thestructure described above, a control circuit 5 sends a control signal Spto the treatment apparatus 321 and performs a control routine, forcingthe fluid to impinge on a predetermined pattern area. When the treatmentapparatus 321 is to eject predetermined droplets, the droplets areejected by the treatment apparatus 321 in synchronism with the droplets11 ejected by the ink-jet print head 2, the two types of dropletscollide before they impinge on the substrate, and the impact positionsof the droplets are changed. When the treatment apparatus 321 is toeject air, the air is blown in synchronism with the ejection of dropletsfrom the ink-jet print head 2, and the trajectory followed by the fluiddroplets is curved. When the treatment apparatus 321 is to apply anelectric field, the droplets 11 from the ink-jet print head 2 are firstcharged, and the direction and magnitude of the electric field betweenthe electrodes is adjusted based on the control signal Sp, making itpossible to vary the impact positions of the droplets by an arbitraryamount of displacement in the direction of positive or negativeelectrode.

Patterns can be formed at any pattern width in accordance with thestructure described above. As shown, for example, in FIG. 15, thefeeding of control signals Sp is prohibited in area A1 (area of minimumpattern width), allowing the impact positions of the fluid droplets 11to form consistent, finest patterns. On the other hand, in area A2 (areaof large pattern width), control signals Sp are alternately sent to aplurality of treatment apparatus 321. Sending a control signal Sp causesthe impact positions of the droplets to vary in accordance with themagnitude of the control signal. Applying, for example, a controlsignal, to the control circuit 321 a causes energy 721 a to be supplied,and a droplet to be deposited at position P1. Applying a control signalto the control circuit 321 b causes energy 721 b to be supplied, and adroplet to be deposited at position P2. The impact positions changeevery time a droplet 11 is ejected if control signals Sp are alternatelyapplied to the controls circuits 321 a and 321 b in synchronism with thecontrol signals Sh sent to the ink-jet print head 2. As a result ofthis, a pattern-forming region whose width is greater than the diameterof deposited droplets can be filled with the fluid.

According to Embodiment 11, patterns of any pattern width can be formedby controlling the energy outputted by the control circuits 321.

(Embodiment 12)

Embodiment 12 of the present invention relates to a treatment forpromoting chemical reactions by causing droplets of a reaction solutionto collide with droplets of a fluid as a physical-chemical action, andis primarily used in the third arrangement described above.

FIG. 16 is a side view depicting the treatment concept of Embodiment 12.In Embodiment 12, the treatment apparatus 322 is configured inaccordance with the third arrangement such that a reaction solution 722can be mixed in the air with droplets exiting from an ink-jet print head2. The treatment apparatus 322 may, for example, be configured in thesame manner as the ink-jet print head 2 in order to eject the reactionsolution in a controlled manner. The trajectory followed by the reactionsolution 722 from the treatment apparatus 322 is adjusted to achieve aminimum acute angle in relation to the trajectory followed by thedroplets 11 from the ink jet print head 2. This is because a more acuteangle prolongs the time during which the two types of droplets canremain in contact. The control circuit 5 is configured to allow controlsignals Sp to be sent to the treatment apparatus 322 in synchronism withthe control signals Sh sent to the ink-jet print head 2.

When fluid droplets 11 are ejected from the ink-jet print head 2 in thestructure described above, a reaction solution 722 is ejectedsubstantially simultaneously from the treatment apparatus 322. The twotypes of droplets are brought into contact before they reach thesubstrate 1, a chemical reaction or the like is initiated, and thedroplets impinge on the substrate 1 during or after the reaction.

According to Embodiment 12, it is possible to initiate reactions in theair. This approach poses problems when reactions occur during ejection,but is suitable for cases in which reactions occur during impact. Itmay, for example, be suitable for cases in which solidification startsor corrosion develops when a reaction occurs.

(Embodiment 13)

Embodiment 13 of the present invention relates to a detection andcorrection treatment of fluid droplets, and is primarily used in thethird arrangement described abode.

A block diagram of Embodiment 13is shown in FIG. 17. This drawing hassubstantially the same structure as in FIG. 1, and is different in thata treatment apparatus 330 and a detection means 331 thereof areprovided. The treatment apparatus 330, which may, for example, comprisea laser light-emitting diode, a lens, an actuator, and the like, isconfigured such that laser light or another type of light with goodrectilinear propagation properties can be directed in accordance with acontrol signal Sp1 across the trajectory of the droplets 11 ejected fromthe ink-jet print head 2. The detection means 331, which may, forexample, comprise a photodetector, is configured such that light emittedby the treatment apparatus 330 can be detected. The control circuit 5 isconfigured to allow detection signals from the detection means 331 to bereceived, and the ejection timing, position, direction, speed, size, andother attributes of the droplets 11 to be detected. The arrangement alsoallows changes in characteristics brought about by the use of theink-jet print head 2 to be fed back to the control signals. If, forexample, the ejection timing has shifted away from to its standardvalue, the timing of the control signal Sh for controlling the ejectionof fluid from the ink-jet print head 2 is corrected to compensate forthis shift. Because the impact positions of droplets shift when theposition or direction has shifted, a drive signal Sx for motor M1 or adrive signal Sy for motor M2 is sent in order to compensate for thisshift. The relative position of the ink-jet print head 2 with respect tothe substrate 1 can thereby be corrected, and the droplets can bedeposited at appropriate positions along the pattern-forming region.Detection of droplet speed involves performing calculations inaccordance with the width of the pulse within a detection signal Sp2.Specifically, it is believed that because the photodetector has a setdetection surface area, the speed is higher if the pulse formed by apassing droplet is narrower, and lower if the pulse is wider. Thesecorrespond to a linear dependence. If the droplet speed has shifted awayfrom its standard value, the droplets are deposited on the substratefaster or slower than normal. The control circuit 5 sends a controlsignal Sy to the motor M2 for adjusting the relative position in thedirection of the Y-axis in order to compensate for this shift. Thedesired size is detected based on the pulse width of the detectionsignal Sp2. The reason for this is that level fluctuations within thedetection signals increase because the surface area traveled by lightincreases with an increase in the diameter of the droplets. Because thedroplets cannot be appropriately deposited when their size shifts beyonda permissible value, the control circuit 5 performs a step whereby thehead is cleaned or a warning is issued.

According to Embodiment 13, the trajectory of droplets from an ink-jetprint head is detected and corrected, making it possible to accuratelyform patterns even when the head is develops problems or when itscharacteristics have changed as a *result of prolonged use.

OTHER MODIFICATIONS

The present invention can be used after being modified in a variety ofways irrespective of the embodiments described above. Specifically, thescope of ideas pertaining to the present invention includes, in additionto cases in which a fluid is ejected from an ink-jet print head, casesin which treatments are performed before ejection, after ejection, orbefore the droplets impinge on the substrate. For example, patternformation was stated as an object in the embodiments described above,but this is not the only object. Various applications are possible aslong as ink can be ejected from an ink-jet print head or the like andspecific effects obtained, both in commercial and consumer applications.

The above-described embodiments may also be used individually, or aplurality of them may be used at the same time. In particular, atreatment should preferably be conducted using a plurality of treatmentapparatus when pattern formation is completed as a result of a pluralityof steps. For example, it is suggested that adherence of droplets to asubstrate can be facilitated by performing surface modification with theaid of the treatment apparatus of the first arrangement before thedroplets are ejected, the treatment apparatus of the third arrangementcan be used to perform a treatment in which the attributes of the fluiddroplets thus ejected are detected and the positions thereof arecorrected, the droplets can be finally concentrated on the substratewith the aid of the treatment apparatus of the second arrangement, andthe like.

According to the present invention, a structure is provided such that atreatment can be performed before the fluid is ejected onto thesubstrate, allowing the formation of patterns by ink-jet systems to bepromoted through pretreatments. It is therefore possible to dispensewith bulky plant equipment and to form arbitrary patterns on substratesat a low cost.

According to the present invention, a structure is provided such that atreatment can be performed after the fluid has been ejected onto thesubstrate, allowing the formation of patterns by ink-jet systems to bepromoted through aftertreatments. It is therefore possible to dispensewith bulky plant equipment and to form arbitrary patterns on substratesat a low cost.

According to the present invention, a structure is provided such that atreatment can be performed the moment a fluid is ejected, allowingenergy to be imparted or causing droplets to undergo reactions in theair. It is therefore possible to dispense with bulky plant equipment andto form arbitrary patterns on substrates at a low cost.

The entire disclosure of Japanese Patent Application NO. 008016/1998filed on Jan. 19, 1998 including specification, claims, drawings andsummary are incorporated herein by reference in its entirety.

1. A pattern formation method for discharging a prescribed fluid onto asubstrate from an ink-jet head forming an arbitrary pattern, saidpattern formation method comprising: a first step of disposing aplurality of first droplets of the fluid at certain intervals on apattern-forming region of the substrate; a second step of disposing aplurality of second droplets of the fluid on the pattern-forming regionof the substrate, the second step being performed while the firstdroplets have a surface tension that prevents the first and seconddroplets from intermixing so that second droplets overlapping the firstdroplets slide along the first droplets and situate within the intervalsbetween the first droplets; wherein the arbitrary pattern is formed atleast by the first and second steps; the prescribed fluid for formingpatterns on the substrate includes a material for industrial use; andthe fluid for the first and second droplets is the same material.
 2. Thepattern formation method according to claim 1, wherein the second stepfurther comprises controlling an amount of the second droplets of thefluid so that the pattern-forming region is filled with the first andsecond droplets of the fluid.
 3. The pattern formation method accordingto claim 1, wherein the material comprises a metal for forming aconductive pattern on a substrate.